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AN1542 Datasheet(PDF) 3 Page - STMicroelectronics |
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AN1542 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 6 page  APPLICATION NOTE 3/6 losses Pfwd Forward mode SMPS break down Reverse mode Thermal runaway time Monotonous variation t0 Prev Fig. 4: Typical loss variation in the OR-ing before and after the SMPS failure In these more complicated cases, device thermal behavior can be simulated with tools like PSPICE. The following analogies have to be used: Tj Forward mode continuous variation SMPS break down Reverse mode Monotonous variation time Thermal runaway Tamb Fig. 5: Typical junction temperature variation in the OR-ing before and after the SMPS failure More complicated cases, where the assumptions of §3.2 do not exist, can be considered. For example: s OR-ing diode not on its own heatsink. The OR-ing diode can be mounted on common heatsink with other dissipative devices. In this case, the junction temperature of the OR-ing di- ode can be influenced by the other devices, thanks to coupling thermal resistance. s Non constant thermal resistance system: The convection can be forced by a fan con- nected to the Anode side of the OR-ing diode. In case of SMPS failure, the fan will stop and the Rth(j-a) will increase. In this case, the junction temperature variation will not be monotonous. 3.3. Results in more complicated cases Tj Forward mode continuous variation SMPS break down Fan switch OFF Reverse mode Thermal runaway Tamb time NON-monotonous variation t0 Fig. 6: Example of junction temperature variation in non-constant thermal resistance system Rth(c-a) P (losses) Rth(j-c) Tamb Tcase Tjunction Junction Case Ambiant Fig. 7: Thermal / electric analogy for simulation This analogy can be use to analyze any complex thermal problem. Thermal: Electrical: Temperature Voltage Power Current Resistance Resistance |
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Similar Description - AN1542 |
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