TGA2535-SM

X-Band Power Amplifier

Data Sheet: Rev A 10/25/11

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Disclaimer: Subject to change without notice

Applications Information

PC Board Layout

0.0175”.

The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land

pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company

to company, careful process development is recommended.

For further technical information, refer to the TGA2533-SM Product Information page.

R1

C1

R2

C2

C3

C5

C6

C4

Bill of Material

© 2011 TriQuint Semiconductor, Inc.

Ref Des

Value

Description

Manufacturer

Part Number

C1, C2, C3

100 pF

Cap, 0402, 50 V, 5%, COG

various

C4, C5, C6

1 uF

Cap, 0603, 25 V, 10%, X5R

various

R1, R2

100K Ohms

Res, 0603, 0.1 W, 5%, SMD

various