TAT7430B

CATV 75 Ω pHEMT High Gain RF Amplifier

Mechanical Information

Package Information and Dimensions

This package is lead-free/RoHS-compliant. The plating

material on the leads is 100 % Matte Tin. It is compatible

with both lead-free

(maximum 260 °C reflow

temperature) and lead (maximum 245 °C reflow

temperature) soldering processes.

The TAT7430B will be marked with a “TAT7430B”

designator and an alphanumeric lot code.

Mounting Configuration

Data Sheet: Rev B 03/08/11

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Disclaimer: Subject to change without notice

© 2011 TriQuint Semiconductor, Inc.

Connecting the Digital World to the Global Network

®

Notes:

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35 mm (#80/.0135”) diameter drill and

have a final, plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. RF trace width depends upon the PC board material and construction.

4. All dimensions are in millimeters (inches). Angles are in degrees.