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R5F213M6UNXXXNP Datasheet(PDF) 1 Page - Renesas Technology Corp |
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R5F213M6UNXXXNP Datasheet(HTML) 1 Page - Renesas Technology Corp |
1 / 93 page R01DS0112EJ0110 Rev.1.10 Page 1 of 88 Jun 15, 2011 R8C/3MU Group, R8C/3MK Group RENESAS MCU Datasheet 1. Overview 1.1 Features The R8C/3MU Group, R8C/3MK Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3MU Group, R8C/3MK Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function. 1.1.1 Applications Peripherals (USB applicable), audio components, cameras, televisions, household appliances, office equipment, communication devices, mobile devices, industrial equipment, and other applications. R01DS0112EJ0110 Rev.1.10 Jun 15, 2011 |
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