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IRFBC30L Datasheet(PDF) 2 Page - International Rectifier

Part # IRFBC30L
Description  Power MOSFET(Vdss=600V, Rds(on)max=2.2ohm, Id=3.6A)
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Manufacturer  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

IRFBC30L Datasheet(HTML) 2 Page - International Rectifier

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IRFBC30AS/L
2
www.irf.com
Parameter
Min. Typ. Max. Units
Conditions
gfs
Forward Transconductance
2.1
–––
–––
S
VDS = 50V, ID = 2.2A
Qg
Total Gate Charge
–––
–––
23
ID = 3.6A
Qgs
Gate-to-Source Charge
–––
–––
5.4
nC
VDS = 480V
Qgd
Gate-to-Drain ("Miller") Charge
–––
–––
11
VGS = 10V, See Fig. 6 and 13
„
td(on)
Turn-On Delay Time
–––
9.8
–––
VDD = 300V
tr
Rise Time
–––
13
–––
ID = 3.6A
td(off)
Turn-Off Delay Time
–––
19
–––
RG = 12Ω
tf
Fall Time
–––
12
–––
RD = 82Ω,See Fig. 10
„
Ciss
Input Capacitance
–––
510
–––
VGS = 0V
Coss
Output Capacitance
–––
70
–––
VDS = 25V
Crss
Reverse Transfer Capacitance
–––
3.5
–––
pF
ƒ = 1.0MHz, See Fig. 5
Coss
Output Capacitance
–––
730
–––
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz
Coss
Output Capacitance
–––
19
–––
VGS = 0V, VDS = 480V, ƒ = 1.0MHz
Coss eff.
Effective Output Capacitance
–––
31
–––
VGS = 0V, VDS = 0V to 480V
…
Dynamic @ TJ = 25°C (unless otherwise specified)
ns
Parameter
Typ.
Max.
Units
EAS
Single Pulse Avalanche Energy
‚
–––
290
mJ
IAR
Avalanche Current

–––
3.6
A
EAR
Repetitive Avalanche Energy

–––
7.4
mJ
Avalanche Characteristics
S
D
G
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
MOSFET symbol
(Body Diode)
–––
–––
showing the
ISM
Pulsed Source Current
integral reverse
(Body Diode)

–––
–––
p-n junction diode.
VSD
Diode Forward Voltage
–––
–––
1.6
V
TJ = 25°C, IS = 3.6A, VGS = 0V
„
trr
Reverse Recovery Time
–––
400
600
ns
TJ = 25°C, IF = 3.6A
Qrr
Reverse RecoveryCharge
–––
1.1
1.7
µC
di/dt = 100A/µs
„
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Diode Characteristics
3.6
14
A
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
600
–––
–––
V
VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
–––
0.67
–––
V/°C
Reference to 25°C, ID = 1mA
†
RDS(on)
Static Drain-to-Source On-Resistance
–––
–––
2.2
VGS = 10V, ID = 2.2A
„
VGS(th)
Gate Threshold Voltage
2.0
–––
4.5
V
VDS = VGS, ID = 250µA
–––
–––
25
µA
VDS = 600V, VGS = 0V
–––
–––
250
VDS = 480V, VGS = 0V, TJ = 125°C
Gate-to-Source Forward Leakage
–––
–––
100
VGS = 30V
Gate-to-Source Reverse Leakage
–––
–––
-100
nA
VGS = -30V
Static @ TJ = 25°C (unless otherwise specified)
IGSS
IDSS
Drain-to-Source Leakage Current
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
–––
1.7
°C/W
RθJA
Junction-to-Ambient ( PCB Mounted, steady-state)*
–––
40
Thermal Resistance


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