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UPC8105GR Datasheet(PDF) 11 Page - NEC |
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UPC8105GR Datasheet(HTML) 11 Page - NEC |
11 / 12 page Preliminary Data Sheet P13831EJ1V1DS00 11 µµµµPC8158K RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. µµµµPC8158K Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Count: 2, Exposure limit Note: None IR35-00-2 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Exposure limit Note: None – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). |
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