 |
 |
|
| IR2111 |
|
|||||||||||||||
 IRF
|
| |||||||||||||||
|
2 page 
IR2111 B-40 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL Parameter Value Symbol Definition Min. Max. Units VB High Side Floating SupplyVoltage -0.3 625 VS High Side Floating Supply OffsetVoltage VB - 25 VB + 0.3 VHO High Side Floating OutputVoltage VS - 0.3 VB + 0.3 VCC Low Side and Logic Fixed SupplyVoltage -0.3 25 VLO Low Side OutputVoltage -0.3 VCC + 0.3 VIN Logic InputVoltage -0.3 VCC + 0.3 dVs/dt Allowable Offset SupplyVoltageTransient (Figure 2) — 50 V/ns PD Package Power Dissipation @TA ≤ +25°C (8 Lead DIP) — 1.0 (8 Lead SOIC) — 0.625 RθJA Thermal Resistance, Junction to Ambient (8 Lead DIP) — 125 (8 Lead SOIC) — 200 TJ JunctionTemperature — 150 TS StorageTemperature -55 150 °C TL LeadTemperature (Soldering, 10 seconds) — 300 Absolute Maximum Ratings Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur.All voltage parameters are absolute voltages referenced to COM.The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air conditions. Additional information is shown in Figures 7 through 10. V W °C/W Parameter Value Symbol Definition Min. Max. Units VB High Side Floating Supply AbsoluteVoltage VS + 10 VS + 20 VS High Side Floating Supply OffsetVoltage Note 1 600 VHO High Side Floating OutputVoltage VS VB VCC Low Side and Logic Fixed SupplyVoltage 10 20 VLO Low Side OutputVoltage 0 VCC VIN Logic InputVoltage 0 VCC TA AmbientTemperature -40 125 Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. Recommended Operating Conditions The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the recommended conditions. TheVS offset rating is tested with all supplies biased at 15V differential. °C V |
