10

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site www.intersil.com

Sales Office Headquarters

NORTH AMERICA

Intersil Corporation

P. O. Box 883, Mail Stop 53-204

Melbourne, FL 32902

TEL: (321) 724-7000

FAX: (321) 724-7240

EUROPE

Intersil SA

Mercure Center

100, Rue de la Fusee

1130 Brussels, Belgium

TEL: (32) 2.724.2111

FAX: (32) 2.724.22.05

ASIA

Intersil (Taiwan) Ltd.

7F-6, No. 101 Fu Hsing North Road

Taipei, Taiwan

Republic of China

TEL: (886) 2 2716 9310

FAX: (886) 2 2715 3029

IRFP140N

TO-247

3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE

A

b

c

D

E

L

ØR

1

2

3

1

ØS

Q

ØP

BACK VIEW

TERM. 4

3

e

2

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.180

0.190

4.58

4.82

-

b

0.046

0.051

1.17

1.29

2, 3

0.060

0.070

1.53

1.77

1, 2

0.095

0.105

2.42

2.66

1, 2

c

0.020

0.026

0.51

0.66

1, 2, 3

D

0.800

0.820

20.32

20.82

-

E

0.605

0.625

15.37

15.87

-

e

0.219 TYP

5.56 TYP

4

0.438 BSC

11.12 BSC

4

0.090

0.105

2.29

2.66

5

L

0.620

0.640

15.75

16.25

-

0.145

0.155

3.69

3.93

1

ØP

0.138

0.144

3.51

3.65

-

Q

0.210

0.220

5.34

5.58

-

ØR

0.195

0.205

4.96

5.20

-

ØS

0.260

0.270

6.61

6.85

-

NOTES:

2. Lead dimension (without solder).

3. Add typically 0.002 inches (0.05mm) for solder coating.

4. Position of lead to be measured 0.250 inches (6.35mm) from bottom

of dimension D.

5. Position of lead to be measured 0.100 inches (2.54mm) from bottom

of dimension D.

6. Controlling dimension: Inch.

7. Revision 1 dated 1-93.