ADM3232E

Rev. B | Page 10 of 12

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AA

10.50 (0.4134)

10.10 (0.3976)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

16

9

8

1

1.27 (0.0500)

BSC

Figure 15. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-16)

Dimensions shown in millimeters (and inches)

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADM3232EARNZ

–40°C to +85°C

16-Lead SOIC_N

R-16

ADM3232EARNZ-REEL7

–40°C to +85°C

16-Lead SOIC_N

R-16

ADM3232EARUZ

–40°C to +85°C

16-Lead TSSOP

RU-16

ADM3232EARUZ-REEL7

–40°C to +85°C

16-Lead TSSOP

RU-16

ADM3232EARWZ

–40°C to +85°C

16-Lead SOIC_W

RW-16

ADM3232EARWZ-REEL

–40°C to +85°C

16-Lead SOIC_W

RW-16