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HS1-307RH883S Datasheet(PDF) 11 Page - Intersil Corporation

Part # HS1-307RH883S
Description  Radiation Hardened CMOS Analog Switches
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

HS1-307RH883S Datasheet(HTML) 11 Page - Intersil Corporation

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11
HS-302RH/303RH/306RH/307RH/384RH/390RH/883S
Intersil Space Level Product Flow
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 72hrs. min.,
+125oC min.
100% Interim Electrical Test (T1)
100% Delta Calculation (T0-T1)
100% PDA, Method 5004 (Note 1)
100% Dynamic Burn-In, Condition D, 240 hrs., +125oCor
Equivalent, Method 1015
100% Interim Electrical Test (T2)
100% Delta Calculation (T0-T2)
100% PDA, Method 5004 (Note 1)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic, Method 2012 (Note 2)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 3)
Sample - Group B, Method 5005
Sample - Group D, Method 5005
100% Data Package Generation (Note 4)
NOTES:
1. Failures from subgroup 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
2. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
3. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
4. Data Package Contents:
• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity).
• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
• X-Ray report and film. Includes penetrometer measurements.
• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
• Lot Serial Number Sheet (Good units serial number and lot number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test. (See Table 6)
• Group B and D attributes and/or Generic data.
• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number
518526


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