CYStech Electronics Corp.

Spec. No. : C966FP

Issued Date : 2014.05.13

Revised Date : 2014.05.15

Page No. : 8/ 8

MTE130N20FP

CYStek Product Specification

TO-220FP Dimension

*Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

Marking:

Date Code

Device Name

E130

N20

Style: Pin 1.Gate 2.Drain 3.Source

3-Lead TO-220FP Plastic Package

CYStek Package Code: FP

DIM

Min.

Max.

Min.

Max.

A

0.171

0.183

4.35

4.65

G

0.246

0.258

6.25

6.55

A1

0.051 REF

1.300 REF

H

0.138 REF

3.50 REF

A2

0.112

0.124

2.85

3.15

H1

0.055 REF

1.40 REF

A3

0.102

0.110

2.60

2.80

H2

0.256

0.272

6.50

6.90

b

0.020

0.030

0.50

0.75

J

0.031 REF

0.80 REF

b1

0.031

0.041

0.80

1.05

K

0.020

0.50 REF

b2

0.047 REF

1.20 REF

L

1.102

1.118

28.00

28.40

c

0.020

0.030

0.500

0.750

L1

0.043

0.051

1.10

1.30

D

0.396

0.404

10.06

10.26

L2

0.036

0.043

0.92

1.08

E

0.583

0.598

14.80

15.20

M

0.067 REF

1.70 REF

e

0.100 *

2.54*

N

0.012 REF

0.30 REF

F

0.106 REF

2.70 REF

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.