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HGTG20N50C1D Datasheet(PDF) 1 Page - Intersil Corporation |
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HGTG20N50C1D Datasheet(HTML) 1 Page - Intersil Corporation |
1 / 5 page 3-71 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 HGTG20N50C1D 20A, 500V N-Channel IGBT with Anti-Parallel Ultrafast Diode Features • 20A, 500V • Latch Free Operation • Typical Fall Time < 500ns • High Input Impedance • Low Conduction Loss • With Anti-Parallel Diode •tRR < 60ns Description The IGBT is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors. The device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between +25oC and +150oC. The diode used in parallel with the IGBT is an ultrafast (tRR < 60ns) with soft recovery characteristic. IGBTs are ideal for many high voltage switching applications operating at frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contractors. PACKAGING AVAILABILITY PART NUMBER PACKAGE BRAND HGTG20N50C1D TO-247 G20N50C1D NOTE: When ordering, use the entire part number. April 1995 Package JEDEC STYLE TO-247 Terminal Diagram COLLECTOR GATE COLLECTOR EMITTER (BOTTOM SIDE METAL) C G E Absolute Maximum Ratings TC = +25oC, Unless Otherwise Specified HGTG20N50C1D UNITS Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BVCES 500 V Collector-Gate Voltage RGE = 1MΩ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BVCGR 500 V Collector Current Continuous at TC = +25 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I C25 26 A at TC = +90 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I C90 20 A Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM 35 A Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES ±20 V Diode Forward Current at TC = +25 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I F25 26 A at TC = +90 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I F90 20 A Power Dissipation Total at TC = +25 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P D 75 W Power Dissipation Derating TC > +25 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 W/oC Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to +150 oC Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 260 oC NOTE: 1. TJ = +150 oC, Minimum R GE = 25Ω without latch INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS: 4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,567,641 4,587,713 4,598,461 4,605,948 4,618,872 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027 File Number 2796.3 |
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