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HCTS373D Datasheet(PDF) 10 Page - Intersil Corporation |
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HCTS373D Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 11 page 647 HCTS373MS Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCTS373MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS373 is TA14403A. OE (1) Q7 (19) VCC (20) Q0 (2) D1 (4) D0 (3) Q1 (5) Q2 (6) D2 (7) (8) (9) (10) (11) (12) (13) D3 Q3 GND LE Q4 D4 (14) D5 (15) Q5 (16) Q6 (17) D6 (18) D7 Spec Number 518636 |
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