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HCTS240AD Datasheet(PDF) 10 Page - Intersil Corporation |
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HCTS240AD Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 10 page 10 HCTS240AMS Spec Number 518889 Die Characteristics DIE DIMENSIONS: 106mils x 108mils 2.68mm x 2.74mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCTS240AMS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS240A is TA14400B. 1 A1 (4) 2 Y2 (5) 1 A2 (6) 2 Y1 (7) (18) 1 Y0 (17) 2 A3 (16) 1 Y1 (15) 2 A2 (14) 1 Y2 |
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