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HCTS190K Datasheet(PDF) 10 Page - Intersil Corporation |
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HCTS190K Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 10 page 10 HCTS190MS Die Characteristics DIE DIMENSIONS: 104 x 86 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCTS190MS NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS190 is TA14444A. Q0 (3) CE (4) U/D (5) Q2 (6) Q3 (7) (14) CP (13) RC (12) TC (11) PL (15) P0 Spec Number 518614 |
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