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HCTS139KMSR Datasheet(PDF) 9 Page - Intersil Corporation |
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HCTS139KMSR Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 9 page 528 HCTS139MS Die Characteristics DIE DIMENSIONS: 2.74mm x 2.68mm 108 mils x 106 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCTS139MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS139 is TA14409. E1 1 (1) A0 1 (2) A1 1 (3) Y0 1 (4) Y1 1 (5) Y2 2 (6) (7) (8) GND (9) 2 Y3 (10) 2 Y2 (11) 2 Y1 (12) 2 Y0 (13) 2 A1 VCC E 2 (14) 2 A0 Y3 1 (15) (16) Spec Number 518606 |
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