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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

HCS573MS

Intersil Space Level Product Flow - ‘MS’

Wafer Lot Acceptance (All Lots) Method 5007

(Includes SEM)

GAMMA Radiation Verification (Each Wafer) Method 1019,

4 Samples/Wafer, 0 Rejects

100% Nondestructive Bond Pull, Method 2023

Sample - Wire Bond Pull Monitor, Method 2011

Sample - Die Shear Monitor, Method 2019 or 2027

100% Internal Visual Inspection, Method 2010, Condition A

100% Temperature Cycle, Method 1010, Condition C,

10 Cycles

100% Constant Acceleration, Method 2001, Condition per

Method 5004

100% PIND, Method 2020, Condition A

100% External Visual

100% Serialization

100% Initial Electrical Test (T0)

100% Static Burn-In 1, Condition A or B, 24 hrs. min.,

100% Interim Electrical Test 1 (T1)

100% Delta Calculation (T0-T1)

100% Static Burn-In 2, Condition A or B, 24 hrs. min.,

100% Interim Electrical Test 2 (T2)

100% Delta Calculation (T0-T2)

100% PDA 1, Method 5004 (Notes 1and 2)

Equivalent, Method 1015

100% Interim Electrical Test 3 (T3)

100% Delta Calculation (T0-T3)

100% PDA 2, Method 5004 (Note 2)

100% Final Electrical Test

100% Fine/Gross Leak, Method 1014

100% Radiographic, Method 2012 (Note 3)

100% External Visual, Method 2009

Sample - Group A, Method 5005 (Note 4)

100% Data Package Generation (Note 5)

NOTES:

1. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1.

2. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the

failures from subgroup 7.

3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.

4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.

5. Data Package Contents:

• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number,

Quantity).

• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.

• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test

equipment, etc. Radiation Read and Record data on file at Intersil.

• X-Ray report and film. Includes penetrometer measurements.

• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).

• Lot Serial Number Sheet (Good units serial number and lot number).

• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.

• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed

by an authorized Quality Representative.

Spec Number

518771