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HCS138T Datasheet(PDF) 3 Page - Intersil Corporation

Part No. HCS138T
Description  Radiation Hardened Inverting 3-to-8 Line Decoder/Demultiplexer
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Maker  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
(2159
µm x 2565µm x 533µm ±51µm)
85 x 101 x 21mils
±2mil
METALLIZATION:
Type: Al Si
Thickness: 11.0k
Å
±1kÅ
SUBSTRATE POTENTIAL:
Unbiased Silicon on Sapphire
BACKSIDE FINISH:
Sapphire
PASSIVATION:
Type: Silox (SiO2)
Thickness: 13.0k
Å
±2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm2
TRANSISTOR COUNT:
264
PROCESS:
CMOS SOS
Metallization Mask Layout
HCS138T
A1
A0
VCC
A2 (3)
E1 (4)
E2 (5)
E3 (6)
(8)
(9)
(10)
(11) Y4
(12) Y3
(13) Y2
(14) Y1
(2)
(1)
(16)
GND
Y6
Y5
(7)
Y0
(15)
NC
NC
Y7
NC
NC
NOTE:
The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The
mask series for the HCS138 is TA14361A.
HCS138T




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