Data Sheet P11120EJ3V0DS00

8

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.

(3) Because the components will operate at high frequencies, apply chip capacitors and chip resistors with low

parasitic inductance.

(4) The DC capacitor must be attached to input pin and output pin.

(6) In case of improved output level type application circuit, observe precaution not to exceed the power

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions.

For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method

Soldering Conditions

Recommended Condition Symbol

Infrared Reflow

Package peak temperature: 235 °C or below

Time: 30 seconds or less (at 210 °C)

Count: 3, Exposure limit: None

Note

IR35-00-3

VPS

Package peak temperature: 215 °C or below

Time: 40 seconds or less (at 200 °C)

Count: 3, Exposure limit: None

Note

VP15-00-3

Wave Soldering

Soldering bath temperature: 260 °C or below

Time: 10 seconds or less

Count: 1, Exposure limit: None

Note

WS60-00-1

Partial Heating

Pin temperature: 300 °C

Time: 3 seconds or less (per side of device)

Exposure limit: None

Note

–

Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).