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AN87C196 Datasheet(PDF) 19 Page - Intel Corporation

Part No. AN87C196
Description  CHMOS 16-BIT MICROCONTROLLER
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Maker  INTEL [Intel Corporation]
Homepage  http://www.intel.com
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19
AUTOMOTIVE
®
PRODUCT PREVIEW
6.0 THERMAL CHARACTERISTICS
All thermal impedance data is approximate for static air conditions at 1 watt of power dissipation. Values will
change depending on operating conditions and the application. The Intel
Packaging Handbook (order number
240800) describes Intel’s thermal impedance test methodology. The
Components Quality and Reliability
Handbook (order number 210997) provides quality and reliability information.
7.0 DESIGN CONSIDERATIONS
To be supplied.
8.0
DEVICE ERRATA
There is no known device errata at this time.
9.0 DATASHEET REVISION HISTORY
This datasheet is valid for devices with an “A” at the end of the topside field process order (FPO) number.
Datasheets are changed as new device information becomes available. Verify with your local Intel sales office
that you have the latest version before finalizing a design or ordering devices.
Table 8. Thermal Characteristics
Package Type
θ
JA
θ
JC
AN87C196LB (52-pin PLCC)
42°C/W
15°C/W
NOTES:
1.
θ
JA = Thermal resistance between junction and the surrounding environment (ambient). Measure-
ments are taken 1 ft. away from case in static air flow environment.
θ
JC = Thermal resistance between juction and package surface (case).
2.
All values of
θ
JA and θJC may fluctuate depending on the environment (with or without airflow, and
how much airflow) and device power dissipation at temperature of operation. Typical variations are
±2°C/W.
3.
Values listed are at a maximum power dissipation of 0.50 W.




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