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TE28F160B3-B150 Datasheet(PDF) 1 Page - Intel Corporation |
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TE28F160B3-B150 Datasheet(HTML) 1 Page - Intel Corporation |
1 / 49 page E PRELIMINARY May 1997 Order Number: 290580-002 n Flexible SmartVoltage Technology 2.7V–3.6V Program/Erase 2.7V–3.6V Read Operation 12V VPP Fast Production Programming n 2.7V or 1.8V I/O Option Reduces Overall System Power n Optimized Block Sizes Eight 4-KW Blocks for Data, Top or Bottom Locations Up to Thirty-One 32-KW Blocks for Code n High Performance 2.7V–3.6V: 120 ns Max Access Time n Block Locking VCC-Level Control through WP# n Low Power Consumption 20 mA Maximum Read Current n Absolute Hardware-Protection VPP = GND Option VCC Lockout Voltage n Extended Temperature Operation –40°C to +85°C n Supports Code Plus Data Storage Optimized for FDI, Flash Data Integrator Software Fast Program Suspend Capability Fast Erase Suspend Capability n Extended Cycling Capability 10,000 Block Erase Cycles n Automated Word Program and Block Erase Command User Interface Status Registers n SRAM-Compatible Write Interface n Automatic Power Savings Feature n Reset/Deep Power-Down 1 µA ICCTypical Spurious Write Lockout n Standard Surface Mount Packaging 48-Ball µBGA* Package 48-Lead TSOP Package n Footprint Upgradeable Upgradeable from 2-, 4- and 8-Mbit Boot Block n ETOX™ V (0.4 µ) Flash Technology The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature- rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective, monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide products will be available in 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp. SMART 3 ADVANCED BOOT BLOCK WORD-WIDE 4-MBIT (256K X 16), 8-MBIT (512K X 16), 16-MBIT (1024K X 16) FLASH MEMORY FAMILY 28F400B3, 28F800B3, 28F160B3 |
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