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TE28F800C3B90 Datasheet(PDF) 8 Page - Intel Corporation

Part # TE28F800C3B90
Description  3 VOLT ADVANCED BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
Download  59 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

TE28F800C3B90 Datasheet(HTML) 8 Page - Intel Corporation

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3 VOLT ADVANCED+ BOOT BLOCK
E
8
PRODUCT PREVIEW
A13
A11
A8
VPP
WP#
A7
A4
A
B
C
D
E
F
123
456
7
8
A14
A10
WE#
RP#
A18
A17
A5
A2
A15
A12
A9
A6
A3
A1
A16
D14
D5
D11
D2
D8
CE#
A0
VCCQ
D15
D6
D12
D3
D9
D0
GND
GND
D7
D13
D4
VCC
D10
D1
OE#
A19
16M
A20
32M
NOTES:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the
upgrade address for the 32-Mbit device.
2.
8-Mbit not available on
µBGA* CSP.
Figure 3. x16 48-Ball
µBGA* Chip Size Package (Top View, Ball Down)
A14
A12
A8
VPP
WP#
A7
A4
A
B
C
D
E
F
1
234
56
7
8
A15
A10
WE#
RP#
A19
A18
A5
A2
A16
A13
A9
A6
A3
A1
A17
NC
D5
NC
D2
NC
CE#
A0
VCCQ
A11
D6
NC
D3
NC
D0
GND
GND
D7
NC
D4
VCC
NC
D1
OE#
A20
A21
32M
16M
NOTES:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A20 is the upgrade address for the 16-Mbit device. A21 is the
upgrade address for the 32-Mbit device.
2.
8-Mbit not available on
µBGA* CSP.
Figure 4. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)


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