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TB28F016S5-110 Datasheet(PDF) 7 Page - Intel Corporation |
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TB28F016S5-110 Datasheet(HTML) 7 Page - Intel Corporation |
7 / 37 page E BYTE-WIDE SMART 5 FlashFile™ MEMORY FAMILY 7 PRODUCT PREVIEW Table 1. Pin Descriptions Sym Type Name and Function A0–A20 INPUT ADDRESS INPUTS: Inputs for addresses during read and write operations. Addresses are internally latched during a write cycle. 4 Mbit → A 0–A18 8 Mbit → A 0–A19 16 Mbit → A 0–A20 DQ0–DQ7 INPUT/ OUTPUT DATA INPUT/OUTPUTS: Inputs data and commands during CUI write cycles; outputs data during memory array, status register, and identifier code read cycles. Data pins float to high-impedance when the chip is deselected or outputs are disabled. Data is internally latched during a write cycle. CE# INPUT CHIP ENABLE: Activates the device’s control logic, input buffers, decoders, and sense amplifiers. CE#-high deselects the device and reduces power consumption to standby levels. RP# INPUT RESET/DEEP POWER-DOWN: When driven low, RP# inhibits write operations which provides data protection during power transitions, puts the device in deep power-down mode, and resets internal automation. RP#-high enables normal operation. Exit from deep power-down sets the device to read array mode. RP# at VHH enables setting of the master lock-bit and enables configuration of block lock-bits when the master lock-bit is set. RP# = VHH overrides block lock-bits, thereby enabling block erase and program operations to locked memory blocks. Block erase, program, or lock-bit configuration with VIH < RP# < VHH produce spurious results and should not be attempted. OE# INPUT OUTPUT ENABLE: Gates the device’s outputs during a read cycle. WE# INPUT WRITE ENABLE: Controls writes to the CUI and array blocks. Addresses and data are latched on the rising edge of the WE# pulse. RY/BY# OUTPUT READY/BUSY#: Indicates the status of the internal WSM. When low, the WSM is performing an internal operation (block erase, program, or lock-bit configuration). RY/BY#-high indicates that the WSM is ready for new commands, block erase or program is suspended, or the device is in deep power-down mode. RY/BY# is always active. VPP SUPPLY BLOCK ERASE, PROGRAM, LOCK-BIT CONFIGURATION POWER SUPPLY: For erasing array blocks, programming data, or configuring lock-bits. Smart 5 Flash → 5V and 12V VPP With VPP ≤ VPPLK, memory contents cannot be altered. Block erase, program, and lock-bit configuration with an invalid VPP (see DC Characteristics) produce spurious results and should not be attempted. VCC SUPPLY DEVICE POWER SUPPLY: Internal detection automatically configures the device for optimized read performance. Do not float any power pins. Smart 5 Flash → 5V VCC With VCC ≤ VLKO, all write attempts to the flash memory are inhibited. Device operations at invalid VCC voltages (see DC Characteristics) produce spurious results and should not be attempted. GND SUPPLY GROUND: Do not float any ground pins. NC NO CONNECT: Lead is not internally connected; it may be driven or floated. |
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