1.5MHz, Rail-to-Rail Output

Operational Amplifiers

2

SGM8931/2/3/4

SG Micro Corp

www.sg-micro.com

PACKAGE/ORDERING INFORMATION

MODEL

ORDER NUMBER

PACKAGE

DESCRIPTION

PACKAGE

OPTION

MARKING

INFORMATION

SGM8931AYN5G/TR

SOT-23-5

Tape and Reel, 3000

SAAXX

SGM8931BYN5G/TR

SOT-23-5

Tape and Reel, 3000

SB1XX

SGM8931YC5G/TR

SC70-5

Tape and Reel, 3000

SABXX

SGM8931YS8G/TR

SOIC-8

Tape and Reel, 2500

SGM8931YS8

SGM8931

SGM8931YMS8G/TR

MSOP-8

Tape and Reel, 3000

SGM8931YMS8

SGM8932YMS8G/TR

MSOP-8

Tape and Reel, 3000

SGM8932YMS8

SGM8932

SGM8932YS8G/TR

SOIC-8

Tape and Reel, 2500

SGM8932YS8

SGM8933YN6G/TR

SOT-23-6

Tape and Reel, 3000

SA8XX

SGM8933YS8G/TR

SOIC-8

Tape and Reel, 2500

SGM8933YS8

SGM8933

SGM8933YMS8G/TR

MSOP-8

Tape and Reel, 3000

SGM8933YMS8

SGM8934YS14G/TR

SOIC-14

Tape and Reel, 2500

SGM8934YS14

SGM8934

SGM8934YTS14G/TR

TSSOP-14

Tape and Reel, 3000

SGM8934YTS14

NOTE: Package marking is defined as the follow:

MARKING INFORMATION

For example: SAABA (2011, January)

SYY X X

Date code - Year ("A" = 2010, "B" = 2011 …)

Date code - Month ("A" = Jan. "B" = Feb. … "L" = Dec.)

Chip I.D.

 

ABSOLUTE MAXIMUM RATINGS

Storage Temperature Range..............................-65

℃ to +150℃

Junction Temperature .......................................................150

℃

Operating Temperature Range........................... -40

℃ to +85℃

Lead Temperature (Soldering 10sec)

...........................................................................................260

℃

ESD Susceptibility

HBM (SGM8931/2/4).........................................................8000V

HBM (SGM8933)...............................................................4000V

MM .....................................................................................400V

NOTE:

Stresses beyond those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device. These

are stress ratings only, and functional operation of the device at

these or any other conditions beyond those indicated in the

operational sections of the specifications is not implied.

Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

CAUTION

This integrated circuit can be damaged by ESD if you don’t pay

attention to ESD protection. SGMICRO recommends that all

integrated circuits be handled with appropriate precautions.

Failure to observe proper handling and installation procedures

can cause damage. ESD damage can range from subtle

performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because

very small parametric changes could cause the device not to

meet its published specifications.

SGMICRO reserves the right to make any change in circuit

design, specification or other related things if necessary without

notice at any time. Please contact SGMICRO sales office to get

the latest datasheet.