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SGM3005 Datasheet(PDF) 2 Page - SG Micro Corp |
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SGM3005 Datasheet(HTML) 2 Page - SG Micro Corp |
2 / 12 page Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch 2 SGM3005 SG Micro Corp www.sg-micro.com PACKAGE/ORDERING INFORMATION MODEL PIN- PACKAGE SPECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKAGE OPTION MSOP-10 -40 ℃ to +125℃ SGM3005XMS/TR SGM3005XMS Tape and Reel, 3000 SGM3005 TDFN-3×3-10L -40 ℃ to +125℃ SGM3005XD/TR SGM3005D Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS V+ to GND.................................................................-0.3V to 6V Analog, Digital voltage range (1)..................-0.3V to (V+) + 0.3V Continuous Current NO, NC, or COM..........................±300mA Peak Current NO, NC, or COM....................................±500mA Operating Temperature Range .......................-40 ℃ to +125℃ Junction Temperature .....................................................150 ℃ Storage Temperature Range...........................-65 ℃ to +150℃ Package Thermal Resistance @ TA = 25 ℃ TDFN-3×3-10L, θJA.........................................................33 ℃/W MSOP-10, θJA...............................................................205 ℃/W Lead Temperature (soldering, 10s)..................................260 ℃ ESD Susceptibility HBM.................................................................................2000V MM.....................................................................................400V NOTES: 1. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings. 2. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SGMICRO reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. Please contact SGMICRO sales office to get the latest datasheet. PIN DESCRIPTION NAME PIN FUNCTION V+ 1 Power Supply. GND 6 Ground. IN1, IN2 4, 8 Digital Control Pin to Connect the COM Terminal to the NO or NC Terminals. COM1, COM2 3, 9 Common Terminal. NO1, NO2 2, 10 Normally-Open Terminal. NC1, NC2 5, 7 Normally-Closed Terminal. NOTE: NO, NC and COM terminals may be an input or output. |
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