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UPA103B Datasheet(PDF) 6 Page - NEC |
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UPA103B Datasheet(HTML) 6 Page - NEC |
6 / 8 page µPA103 6 Data Sheet P10708EJ2V0DS00 NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Design circuits connected Sub pin to the lowest voltage to prevent latch-up. (4) Design circuits as each pin voltage difference within 15 V maximum. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µPA103G Soldering process Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235 °C, Hour: within 30 s. (more than 210 °C), Time: 2 times, Limited days: no.Note VPS Package peak temperature: 215 °C, Hour: within 40 s. (more than 200 °C), Time: 2 times, Limited days: no.Note Wave soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s. Time: 1 time, Limited days: no.Note Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s./pin Limited days: no.Note µPA103B Soldering process Soldering conditions Symbol Infrared ray reflow Peak package’s surface temperature: 230 °C or below, Reflow time: 10 seconds or below (210 °C or higher), Number of reflow process: 1, Exposure limit*: None Partial heating method Terminal temperature: 260 °C or below, Flow time: 10 seconds or below, Exposure limit*: None Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). IR35-00-2 VP15-00-2 WS60-00-1 |
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