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ELJPC1R0MF Datasheet(PDF) 8 Page - Panasonic Semiconductor

Part # ELJPC1R0MF
Description  Low DCR and large current capability, suitable for power circuitry.
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

ELJPC1R0MF Datasheet(HTML) 8 Page - Panasonic Semiconductor

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Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Fixed Inductors (Chip Inductors)
t2
Time
T3
T2
T1
t1
0
Soldering Conditions
Reflow soldering conditions
● Pb free solder recommended temperature profile
Flow soldering conditions
Preheat: 130 to 150 °C, 60 to 180 s, Soldering: 260 °C, 5 s max.
Notes
● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
● In case the product has been stored for a period longer than 6 months, use the product only after confirmation of its
solderability.
Type
Preheat
Soldering
Peak Temperature
Time of
Reflow
T1 [°C]
t1 [s]
T2 [°C]
t2 [s]
T3
T3 Limit
□F
150 to 180
60 to 120
230 °C
40 max.
250 °C, 10 s
260 °C, 10 s
2 times max.
□E
150 to 180
60 to 120
230 °C
40 max.
250 °C, 10 s
260 °C, 10 s
2 times max.
□D
150 to 180
60 to 120
230 °C
40 max.
245 °C, 10 s
250 °C, 10 s
2 times max.
□C
150 to 180
60 to 120
230 °C
40 max.
245 °C, 10 s
250 °C, 10 s
2 times max.
□A
150 to 180
60 to 120
230 °C
40 max.
245 °C, 10 s
250 °C, 10 s
2 times max.
□B
150 to 180
60 to 120
230 °C
40 max.
245 °C, 10 s
250 °C, 10 s
2 times max.
Sep. 2012
03
8


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