2

Atmel AT27C040 [DATASHEET]

0189J–EPROM–10/2012

2.

Pin Configurations and Pinouts

3.

Switching Considerations

Switching between active and standby conditions via the Chip Enable (CE) pin may produce transient voltage

excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in

device nonconformance. At a minimum, a 0.1μF, high-frequency, low inherent inductance, ceramic capacitor should be

close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large

terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to

the array.

4.

Block Diagram

Pin

Name

Function

Peak to Peak Voltage

Address Inputs

Outputs

GND

Ground

CE

Chip Enable

OE

Output Enable

Device Power Supply

5

6

7

8

9

10

11

12

13

29

28

27

26

25

24

23

22

21

OE

CE

32-lead PLCC

Top view

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

GND

OE

CE

32-lead PDIP

Top view

GND

Address

Inputs

OE

CE

OE, CE, and

Program Logic

Y Decoder

X Decoder

Data Outputs

Output

Buffers

Y-Gating

Cell Matrix

Identification