 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
MGA-81563-BLK Datasheet(PDF) 9 Page - Agilent(Hewlett-Packard) |
|
||||||||||||||||||||||||||||||
MGA-81563-BLK Datasheet(HTML) 9 Page - Agilent(Hewlett-Packard) |
|
|
9 / 12 page  6-204 SUPPLY VOLTAGE (V) 0 2 4 8 6 18 10 12 14 16 NF Gain Power 03 4 5 12 Figure20.Gain,NoiseFigure,and OutputPowervs.SupplyVoltage. Some thermal precautions must be observed for operation at higher bias voltages. For reliable operation, the channel tempera- ture should be kept within the 165 ° C indicated in the “Absolute Maximum Ratings” table. As a guideline, operating life tests have established a MTTF in excess of 106 hours for channel tempera- tures up to 150 ° C. There are several means of biasing the MGA-81563 at 3 volts in systems that use higher power supply voltages. The simplest method, shown in Figure 21a, is to use a series resistor to drop the device voltage to 3 volts. For example, a 47 Ω resistor will drop a 5-volt supply to 3 volts at the nominal current of 42 mA. Some variation in performance could be expected for this method due to variations in current within the specified 31 to 51 mA min/max range. 47 Ω (a) +5 V Silicon Diodes (b) +5 V Zener Diode (c) +5 V Figure21.BiasingFromHigher SupplyVoltages. A second method illustrated in Figure 21b, is to use forward- biased diodes in series with the power supply. For example, three silicon diodes connected in series will drop a 5-volt supply to approximately 3 volts. The use of the series diode approach has the advantage of less dependency on current variation in the amplifiers since the forward voltage drop of a diode is somewhat current independent. Reverse breakdown diodes (e.g., Zener diodes) could also be used as in Figure 21c. However, care should be taken to ensure that the noise generated by diodes in either Zener or reverse break- down is adequately filtered (e.g., bypassed to ground) such that the diode’s noise is not added to the amplifier’s signal. SOT-363 PCB Footprint A recommended PCB pad layout for the miniature SOT-363 (SC-70) package used by the MGA-81563 is shown in Figure 22 (dimensions are in inches). This layout pro- vides ample allowance for pack- age placement by automated assembly equipment without adding parasitics that could impair the high frequency RF performance of the MGA-81563. The layout is shown with a nominal SOT-363 package foot- print superimposed on the PCB pads. 0.026 0.035 0.075 0.016 Figure22.PCBPadLayout (dimensionsininches). SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-363 package, will reach solder reflow temperatures faster than those with a greater mass. |
Similar Part No. - MGA-81563-BLK |
|
Similar Description - MGA-81563-BLK |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
