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MGA-81563-BLK Datasheet(PDF) 6 Page - Agilent(Hewlett-Packard) |
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MGA-81563-BLK Datasheet(HTML) 6 Page - Agilent(Hewlett-Packard) |
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6 / 12 page  6-201 To assist designers in optimizing not only the immediate circuit using the MGA-81563, but to also optimize and evaluate trade-offs that affect a complete wireless system, the standard deviation ( σ) is provided for many of the Electrical Specifica- tions parameters (at 25 °) in addition to the mean. The stan- dard deviation is a measure of the variability about the mean. It will be recalled that a normal distribu- tion is completely described by the mean and standard deviation. Standard statistics tables or calculations provide the probabil- ity of a parameter falling between any two values, usually symmetri- cally located about the mean. Referring to Figure 12 for ex- ample, the probability of a param- eter being between ± 1σ is 68.3%; between ± 2σ is 95.4%; and be- tween ± 3σis99.7%. 68% 95% 99% Parameter Value Mean ( µ) (typical) -3 σ -2σ -1σ +1 σ +2σ +3σ Figure12.NormalDistribution. RF Layout The RF layout in Figure 13 is suggested as a starting point for microstripline designs using the MGA-81563 amplifier. Adequate grounding is needed to obtain optimum performance and to maintain stability. All of the ground pins of the MMIC should be connected to the RF groundplane on the backside of the PCB by means of plated through holes (vias) that are placed near the package termi- nals. As a minimum, one via should be located next to each ground pin to ensure good RF grounding. It is a good practice to use multiple vias to further minimize ground path inductance. 50 Ω 50 Ω RF Input RF Output and Vd Figure13.RFLayout. It is recommended that the PCB pads for the ground pins not be connected together underneath the body of the package. PCB traces hidden under the package cannot be adequately inspected for SMT solder quality. PCB Material FR-4 or G-10 printed circuit board materials are a good choice for most low cost wireless applica- tions. Typical board thickness is 0.020 to 0.031 inches. The width of the 50 Ω microstriplines on PC boards in this thickness range is also very convenient for mounting chip components such as the series inductor at the input or DC blocking and bypass capacitors. For higher frequencies or for noise figure critical applications, the additional cost of PTFE/glass dielectric materials may be warranted to minimize transmis- sion line loss at the amplifier’s input. A 0.5 inch length of 50 Ω microstripline on FR-4, for example, has approximately 0.3 dB loss at 4 GHz. This loss will add directly to the noise figure of the MGA-81563. Biasing The MGA-81563 is a voltage- biased device and is designed to operate from a single, +3 volt power supply with a typical current drain of 42 mA. The internal current regulation circuit allows the amplifier to be oper- ated with voltages as high +5 volts or as low as +1.5 volt. Refer to the section titled “Operation at Bias Voltages Other than 3 Volts” for information on performance and precautions when using other voltages. Typical Application Example The printed circuit layout in Figure 14 can serve as a design guide. This layout is a microstripline design (solid groundplane on the backside of the circuit board) with a 50 Ω input and output. The circuit is fabricated on 0.031-inch thick FR-4 dielectric material. Plated through holes (vias) are used to bring the ground to the top side of the circuit where needed. Multiple vias are used to reduce the inductance of the paths to ground. IN OUT +V H MGA-8-A Figure14.PCBLayout. A schematic diagram of the application circuit is shown in Figure 15. DC blocking capacitors (C1 and C2) are used at the input and output of the MMIC to isolate the device from adjacent circuits. |
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