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IAM-91563-BLK Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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IAM-91563-BLK Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
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7 / 16 page  7-141 or maximum values. For the IAM-91563, these parameters are: Conversion Gain (Gtest), Noise Figure (NFtest), and Device Current (Id). Each of these guaranteed parameters is 100% tested. Values for most of the parameters in the table of Electrical Specifica- tions that are described by typical data are the mathematical mean ( µ), of the normal distribution taken from the characterization data. For parameters where measurements or mathematical averaging may not be practical, such as the Typical Reflection Coefficients table or performance curves, the data represents a nominal part taken from the “center” of the characterization distribution. Typical values are intended to be used as a basis for electrical design. To assist designers in optimizing not only the immediate circuit using the IAM-91563, but to also optimize and evaluate trade-offs that affect a complete wireless system, the standard deviation ( σ) is provided for many of the Electrical Specifications param- eters (at 25 °) in addition to the mean. The standard deviation is a measure of the variability about the mean. It will be recalled that a normal distribution is completely described by the mean and standard deviation. Standard statistics tables or calculations provide the probabil- ity of a parameter falling between any two values, usually symmetri- cally located about the mean. Referring to Figure 12 for ex- ample, the probability of a param- eter being between ± 1σ is 68.3%; between ± 2σ is 95.4%; and be- tween ± 3σis99.7%. 68% 95% 99% Parameter Value Mean ( µ) (typical) -3 σ -2σ -1σ +1 σ +2σ +3σ Figure 19. Normal Distribution. Phase Reference Planes The positions of the reference planes used to specify Reflection Coefficients for this device are shown in Figure 20. As seen in the illustration, the reference planes are located at the point where the package leads contact the test circuit. TEST CIRCUIT REFERENCE PLANES Figure20.PhaseReferencePlanes. RF Layout An RF layout similar to the one in Figure 21 is suggested as a starting point for microstripline designs using the IAM-91563 mixer. This layout shows the capacitor for the Source Bypass pin and the optional resistor used to increase bias current. Adequate grounding is important to obtain maximum performance and to maintain stability. Both of the ground pins of the MMIC should be connected to the RF groundplane on the backside of the PCB by means of plated through holes (vias) that are placed near the package termi- nals. As a minimum, one via should be located next to each of the ground pins to ensure good RF grounding. It is a good practice to use multiple vias to further minimize ground path inductance. C R Figure21.RFLayout. It is recommended that the PCB pads for the ground pins not be connected together underneath the body of the package. PCB traces hidden under the package cannot be adequately inspected for SMT solder quality. PCB Material FR-4 or G-10 printed circuit board materials are a good choice for most low cost wireless applica- tions. Typical board thickness is 0.020 to 0.031 inches. Thicknesses greater than 0.031 inch began to introduce excessive inductance in the ground vias. The width of the 50 Ω microstriplines on PC boards in this thickness range is also very convenient for mounting chip components such as the series inductor at the input or DC blocking and bypass capacitors. For applications using higher frequencies such as the 5.8 GHz ISM band, the additional cost of PTFE/glass dielectric materials may be warranted to minimize transmission line loss at the mixer’s RF input. An additional consideration of using lower cost |
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