HSMJ-T425 datasheet(5/5 Pages) HP

Part #	HSMJ-T425

Description	Surface Mount High Performance AlInGaP LED Indicators

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Manufacturer	HP [Agilent(Hewlett-Packard)]

Direct Link	http://www.home.agilent.com

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5 / 5 page

1-203

4.45

(0.175)

1.65

(0.065)

2.41

(0.095)

INFRARED/VAPOR PHASE

REFLOW SOLDERING

COMPONENT LOCATION

ON PAD

COMPONENT LOCATION

ON PAD

4.45

(0.175)

1.65

(0.065)

2.41

(0.095)

CONDUCTIVE ATTACHMENT

0.64 (0.025) SQ.

CENTERED HOLE

NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

Convective IR Reflow

Soldering

For information on convective IR

reflow soldering, refer to the

Supplement to Application Note

1060, Surface Mounting SMT

LED Components.

Recommended Printed Circuit Board Attachment Pad Geometries

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