 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
HMMC-5022 Datasheet(PDF) 4 Page - Agilent(Hewlett-Packard) |
|
||||||||||||||||||||||||||||||
HMMC-5022 Datasheet(HTML) 4 Page - Agilent(Hewlett-Packard) |
|
|
4 / 6 page  6-31 Figure 2. HMMC-5021/22/26 Bonding Pad Locations. Figure 3. HMMC-5021/22/26 Assembly Diagram. Note: Total offset between RF input and RF output pad is 335 µm (13.2 mils). Notes: All dimensions in microns. Rectangular Pad Dim: 75 x 75 µm. Octagonal Pad Dim: 90 µm dia. All other dimensions ±5 µm (unless otherwise noted). Chip thickness: 127 ± 15 µm. VDD VG1 OUT IN 1.5 mil dia.Gold Wire Bond to ≥15 nF DC Feedthru ≥4 nH Inductor (0.7 mil Gold Wire Bond with length ≥150 mils) 0.7 mil dia. Gold Bond Wire (Length NOT important) Gold Plated Shim ≥68 pF Capacitor Input and Output Thin Film Circuit with ≥8 pF DC Blocking Capacitor 2.0 mil nom. gap 2.0 mil nom. gap Trace Offset 168 µm (6.6 mils) 1.5 mil dia.Gold Wire Bond to ≥15 nF DC Feedthru Bonding Island Trace Offset 168 µm (6.6 mils) |
Similar Part No. - HMMC-5022 |
|
Similar Description - HMMC-5022 |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
