 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
HFBR-5103T Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
|
||||||||||||||||||||||||||||||
HFBR-5103T Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
|
|
8 / 22 page  133 ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommenda- tion is in keeping with good high frequency board layout practices. Board Layout - Hole Pattern The Hewlett-Packard transceiver complies with the circuit board “Common Transceiver Footprint” hole pattern defined in the original multisource announce- ment which defined the 1x9 package style. This drawing is reproduced in Figure 8 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. Board Layout - Art Work The Applications Engineering group has developed Gerber file artwork for a multilayer printed circuit board layout incorporating the recommendations above. Contact your local Hewlett- Packard sales representative for details. Board Layout - Mechanical For applications providing a choice of either a duplex SC or a duplex ST connector interface, while utilizing the same pinout on the printed circuit board, the ST port needs to protrude from the chassis panel a minimum of 9.53 mm for sufficient clearance to install the ST connector. Please refer to Figure 8a for a mechanical layout detailing the Figure 8. Recommended Board Layout Hole Pattern recommended location of the duplex SC and duplex ST trans- ceiver packages in relation to the chassis panel. Regulatory Compliance These transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of Information Technology Equipment. See the Regulatory Compliance Table for details. Additional information is available from your Hewlett- Packard sales representative. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. (8X) 2.54 .100 20.32 .800 20.32 .800 1.9 ± 0.1 .075 ± .004 (2X) ø Ø0.000 MA 0.8 ± 0.1 .032 ± .004 (9X) ø Ø0.000 MA –A– TOP VIEW |
Similar Part No. - HFBR-5103T |
|
Similar Description - HFBR-5103T |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
