706

Figure 11. HDMP-1536/46 (TRx) Package Layout and Marking, Top View.

*Note: Pin 26 is designated as a “no connect” pin and should be left unconnected.

RXCAP0

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

HDMP-15x6

xxxx-x Rz.zz

S

YYWW

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

BYTSYNC

GND_RXTTL

RX[0]

RX[1]

RX[2]

VCC_RXTTL

RX[3]

RX[4]

RX[5]

RX[6]

VCC_RXTTL

RX[7]

RX[8]

RX[9]

GND_RXTTL

GND_TXTTL

TX[0]

TX[1]

TX[2]

VCC_TXTTL

TX[3]

TX[4]

TX[5]

TX[6]

VCC_TXTTL

TX[7]

TX[8]

TX[9]

GND_TXTTL

GND_TXA

TXCAP1

xxxx-x = WAFER LOT NUMBER–BUILD NUMBER

Rzz.zz = DIE REVISION

S = SUPPLIER CODE

YYWW = DATE CODE (YY = YEAR, WW = WORK WEEK)

COUNTRY = COUNTRY OF MANUFACTURE

(MARKED ON BACK OF DEVICE)