HI-8585, HI-8586

0V

10V

-10V

5V

0V

5V

0V

t rx

t

10%

90%

tt

10%

90%

t rx

t

phlx

t

phlx

t

plhx

t

10%

plhx

t

pin 3

pin 2

FIGURE3- LINE DRIVER TIMING

t fx

t

fx

DIFF

PART

PACKAGE

TEMPERATURE

BURN

LEAD

NUMBER

DESCRIPTION

RANGE

FLOW

IN

FINISH

HI-8585PDI

8 PIN PLASTIC DIP

-40°C TO +85°C

I

NO

SOLDER

HI-8585PDT

8 PIN PLASTIC DIP

-55°C TO +125°C

T

NO

SOLDER

HI-8585PSI

8 PIN PLASTIC ESOIC - NB

-40°C TO +85°C

I

NO

SOLDER

HI-8585PST

8 PIN PLASTIC ESOIC - NB

-55°C TO +125°C

T

NO

SOLDER

HI-8585CDI

8 PIN CERAMIC SIDE BRAZED DIP

-40°C TO +85°C

I

NO

GOLD

HI-8585CDT

8 PIN CERAMIC SIDE BRAZED DIP

-55°C TO +125°C

T

NO

GOLD

HI-8585CDM

8 PIN CERAMIC SIDE BRAZED DIP

-55°C TO +125°C

M

YES

SOLDER

HI-8585CRI

8 PIN CERDIP

-40°C TO +85°C

I

NO

SOLDER

HI-8585CRT

8 PIN CERDIP

-55°C TO +125°C

T

NO

SOLDER

HI-8585CRM

8 PIN CERDIP

-55°C TO +125°C

M

YES

SOLDER

HI-8586PDI

8 PIN PLASTIC DIP

-40°C TO +85°C

I

NO

SOLDER

HI-8586PDT

8 PIN PLASTIC DIP

-55°C TO +125°C

T

NO

SOLDER

HI-8586PSI

8 PIN PLASTIC ESOIC - NB

-40°C TO +85°C

I

NO

SOLDER

HI-8586PST

8 PIN PLASTIC ESOIC - NB

-55°C TO +125°C

T

NO

SOLDER

HI-8586CDI

8 PIN CERAMIC SIDE BRAZED DIP

-40°C TO +85°C

I

NO

GOLD

HI-8586CDT

8 PIN CERAMIC SIDE BRAZED DIP

-55°C TO +125°C

T

NO

GOLD

HI-8586CDM

8 PIN CERAMIC SIDE BRAZED DIP

-55°C TO +125°C

M

YES

SOLDER

HI-8586CRI

8 PIN CERDIP

-40°C TO +85°C

I

NO

SOLDER

HI-8586CRT

8 PIN CERDIP

-55°C TO +125°C

T

NO

SOLDER

HI-8586CRM

8 PIN CERDIP

-55°C TO +125°C

M

YES

SOLDER

Legend:

NB

- Narrow Body

ESOIC- Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink)

HOLT INTEGRATED CIRCUITS

5