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HM658512A Datasheet(PDF) 7 Page - Hitachi Semiconductor

Part # HM658512A
Description  4 M PSRAM (512-kword x 8-bit) 2 k Refresh
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Manufacturer  HITACHI [Hitachi Semiconductor]
Direct Link  http://www.renesas.com/eng
Logo HITACHI - Hitachi Semiconductor

HM658512A Datasheet(HTML) 7 Page - Hitachi Semiconductor

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HM658512A Series
7
At the end of self refresh, refresh reset time (t
RFS) is required to reset the internal self refresh operation of
the RAM. During t
RFS, CE and OE/RFSH must be kept high.
If auto refresh follows self refresh, low
transition of
OE/RFSH at the beginning of automatic refresh must not occur during t
RFS period.
Notes on Using the HM658512A
Since pseudo static RAM consists of dynamic circuits like DRAM, its clock pins are more noise-sensitive
than conventional SRAM’s.
(1) If a short
CE pulse of a width less than t
CE min is applied to RAM, an incomplete read occurs and
stored data may be destroyed. Make sure that
CE low pulses of less than t
CE min are inhibited. Note
that a 10 ns
CE low pulse may sometimes occur owing to the gate delay on the board if the CE signal is
generated by the decoding of higher address signals on the board. Avoid these short pulses.
(2)
OE/RFSH works as refresh control in standby mode. A short OE/RFSH low pulse may cause an
incomplete refresh that will destroy data. Make sure that
OE/RFSH low pulse of less than t
FAP min are
also inhibited.
(3) t
OHC and tOCD are the timing specs which distinguish the OE function of OE/RFSH from the RFSH
function. The t
OHC and tOCD specs must be strictly maintained.
(4) Start the HM658512A operating by executing at least eight initial cycles (dummy cycles) at least 100
µs after the power voltage reaches 4.5 V-5.5 V after power-on.
Function Table
CE
OE/RFSH
WE
I/O pin
Mode
L
L
H
Dout
Read
L
X
L
High-Z
Write
L
H
H
High-Z
H
L
X
High-Z
Refresh
H
H
X
High-Z
Standby
Note:
X means H or L.


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