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SSF8810 Datasheet(PDF) 2 Page - Silikron Semiconductor Co.,LTD.

Part # SSF8810
Description  Advanced MOSFET process technology
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Manufacturer  SILIKRON [Silikron Semiconductor Co.,LTD.]
Direct Link  http://www.silikron.com
Logo SILIKRON - Silikron Semiconductor Co.,LTD.

SSF8810 Datasheet(HTML) 2 Page - Silikron Semiconductor Co.,LTD.

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SSF8810
©Silikron Semiconductor CO., LTD.
2013.09.20
Version: 1.0
page 2 of 7
www.silikron.com
Electrical Characteristics @TA=25℃ unless otherwise specified
Symbol
Parameter
Min.
Typ.
Max.
Units
Conditions
V(BR)DSS
Drain-to-Source breakdown voltage
20
V
VGS = 0V, ID = 250μA
RDS(on)
Static Drain-to-Source on-resistance
14
20
m
Ω
VGS=4.5V,ID = 7A
18
TJ = 125°C
20
28
m
Ω
VGS=2.5V,ID = 5.5A
24
TJ = 125°C
38
50
m
Ω
VGS=1.8V,ID = 5A
42
TJ = 125°C
VGS(th)
Gate threshold voltage
0.6
1
V
VDS = VGS, ID = 250μA
IDSS
Drain-to-Source leakage current
1
μA
VDS = 20V,VGS = 0V
50
TJ = 125°C
IGSS
Gate-to-Source forward leakage
100
nA
VGS = 4.5V
-100
VGS = -4.5V
10
uA
VGS = 10V
-10
VGS = -10V
Qg
Total gate charge
10
nC
ID = 7A,
VDS=10V,
VGS = 4.5V
Qgs
Gate-to-Source charge
2.3
Qgd
Gate-to-Drain("Miller") charge
3
td(on)
Turn-on delay time
7.3
ns
VGS=4.5V, VDS =10V,
RGEN=3Ω,ID =6.5
tr
Rise time
60
td(off)
Turn-Off delay time
18
tf
Fall time
5.9
Ciss
Input capacitance
632
pF
VGS = 0V
VDS = 10V
ƒ = 1MHz
Coss
Output capacitance
142
Crss
Reverse transfer capacitance
134
Source-Drain Ratings and Characteristics
Symbol
Parameter
Min.
Typ.
Max.
Units
Conditions
IS
Continuous Source Current
(Body Diode)
8
A
MOSFET symbol
showing
the
integral reverse
p-n junction diode.
ISM
Pulsed Source Current
(Body Diode)
25
A
V
SD
Diode Forward Voltage
1.2
V
IS=2.8A, VGS=0V
trr
Reverse Recovery Time
35
nS
TJ = 25°C, IF =7A,
di/dt = 10
0A/μs
Qrr
Reverse Recovery Charge
7.2
nC


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