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T530X108M003ATE010 Datasheet(PDF) 9 Page - Kemet Corporation

Part # T530X108M003ATE010
Description  T530 Series High Capacitance Polymer Tantalum 125째C
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

T530X108M003ATE010 Datasheet(HTML) 9 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
T2019_T530 • 8/5/2014
99
KEMET Organic Capacitor (KO-CAP) – Low ESR
T530 Series High Capacitance Polymer Tantalum 125°C
Soldering Process
KEMET’s families of surface mount capacitors are compatible
withwave(singleordual),convection,IR,orvaporphasereflow
techniques. Preheating of these components is recommended
toavoidextremethermalstress.KEMET'srecommendedprofile
conditionsforconvectionandIRreflowreflecttheprofileconditions
of the IPC/J–STD–020D standard for moisture sensitivity testing.
Thedevicescansafelywithstandamaximumofthreereflow
passes at these conditions.
Please note that although the X/7343–43 case size can withstand
wavesoldering,thetallprofile(4.3mmmaximum)dictatescarein
wave process development.
Handsolderingshouldbeperformedwithcareduetothedifficulty
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
andthetermination,untilreflowoccurs.Oncereflowoccurs,the
ironshouldberemovedimmediately.“Wiping”theedgesofachip
and heating the top surface is not recommended.
Duringtypicalreflowoperations,aslightdarkeningofthegold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
Profile Feature
SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T
Smin)
100°C
150°C
Temperature Maximum (T
Smax)
150°C
200°C
Time (t
s) from Tsmin to Tsmax)
60 – 120 seconds
60 – 120 seconds
Ramp-up Rate (T
L to TP)
3°C/seconds maximum
3°C/seconds maximum
Liquidous Temperature (T
L)
183°C
217°C
Time Above Liquidous (t
L)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (T
P)
220°C*
235°C**
250°C*
260°C**
Time within 5°C of Maximum
Peak Temperature (t
P)
20 seconds maximum
30 seconds maximum
Ramp-down Rate (T
P to TL)
6°C/seconds maximum
6°C/seconds maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Storage
AllKO-CAPseriesareshippedinmoisturebarrierbagswithadesiccantandmoistureindicatorcard.Theseseriesareclassified
as MSL3 (Moisture Sensitivity Level 3). Product contained within the moisture barrier bags should be stored in normal working
environments with temperatures not to exceed 40°C and humidity not in excess of 60% RH.
Time
Tsmin
25ºC to Peak
tL
tS
25
tP
Tsmax
TL
TP
Maximum Ramp Up Rate = 3ºC/seconds
Maximum Ramp Down Rate = 6ºC/seconds


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