CM1401−03

http://onsemi.com

9

PACKAGE DIMENSIONS

WLCSP15, 2.96x1.33

CASE 567BS−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

0.56

MILLIMETERS

A1

D

2.96 BSC

E

b

0.29

0.35

eD

0.50 BSC

0.65

D

E

A B

PIN A1

REFERENCE

eD

A

0.05

B

C

0.03 C

0.05 C

15X

b

45 6

C

B

A

0.05 C

A

A1

A2

C

0.21

0.27

1.33 BSC

eE

0.435 BSC

0.25

15X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

0.87

0.44

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

eE

A2

0.40 REF

RECOMMENDED

A1

PACKAGE

OUTLINE

12 3

7 8 9

PITCH

eD/2

ON Semiconductor and

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CM1401−03/D

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