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A1324LUA-T2 Datasheet(PDF) 2 Page - Allegro MicroSystems |
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A1324LUA-T2 Datasheet(HTML) 2 Page - Allegro MicroSystems |
2 / 12 page Linear Hall Effect Sensor ICs with Analog Output A1324, A1325, and A1326 2 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com Absolute Maximum Ratings Characteristic Symbol Notes Rating Unit Forward Supply Voltage VCC 8 V Reverse Supply Voltage VRCC –0.1 V Forward Output Voltage VOUT 15 V Reverse Output Voltage VROUT –0.1 V Output Source Current IOUT(SOURCE) VOUT to GND 2 mA Output Sink Current IOUT(SINK) VCC to VOUT 10 mA Operating Ambient Temperature TA L temperature range –40 to 150 ºC Maximum Junction Temperature TJ(max) 165 ºC Storage Temperature Tstg –65 to 170 ºC Terminal List Table Name Number Function LH UA VCC 1 1 Input power supply; tie to GND with bypass capacitor VOUT 2 3 Output signal; also used for programming GND 3 2 Ground Selection Guide Part Number Packing1 Package Sensitivity (Typ.) (mV/G) A1324LLHLT-T 3 000 pieces per reel 3-pin SOT-23W surface mount 5.000 A1324LLHLX-T 10 000 pieces per reel 3-pin SOT-23W surface mount A1324LUA-T2 500 pieces per bag 3-pin ultramini SIP through hole mount A1325LLHLT-T 3 000 pieces per reel 3-pin SOT-23W surface mount 3.125 A1325LLHLX-T 10 000 pieces per reel 3-pin SOT-23W surface mount A1325LUA-T2 500 pieces per bag 3-pin ultramini SIP through hole mount A1326LLHLT-T 3 000 pieces per reel 3-pin SOT-23W surface mount 2.500 A1326LLHLX-T 10 000 pieces per reel 3-pin SOT-23W surface mount A1326LUA-T2 500 pieces per bag 3-pin ultramini SIP through hole mount 1 Contact Allegro™ for additional packing options. 2 Contact factory for availability. Thermal Characteristics may require derating at maximum conditions, see application information Characteristic Symbol Test Conditions* Value Unit Package Thermal Resistance RθJA Package LH, on 4-layer PCB with copper limited to solder pads 228 ºC/W Package LH, on 2-layer PCB with 0.463 in.2 of copper area each side, connected by thermal vias 110 ºC/W Package UA, on 1-layer PCB with copper limited to solder pads 165 ºC/W *Additional thermal information available on the Allegro website Description (continued) 2 3 1 2 1 3 Pin-out Diagrams LH Package UA Package |
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