Surface Mountable PTC

Resettable Fuse

Page <3>

17/05/11 V1.1

http://www.farnell.com

http://www.newark.com

http://www.cpc.co.uk

Material Specification

Terminal pad material

: Pure tin.

Soldering characteristics

: Meets EIA specification RS 186-9E, ANSI/J-std-002 category 3.

Pad Layouts Solder Reflow and Rework Recommendations

The dimension in the table below provide the recommended pad layout for each 0805 device.

Device

A

Nominal

B

Nominal

C

Nominal

All 0805 Series

1.20

1.00

1.50

Profile Feature

Pb-Free Assembly

3°C/second maximum

Preheat:

150°C

200°C

60-180 seconds

Time maintained above:

217°C

60-150 seconds

260°C

Time within 5°C of actual Peak:

20-40 seconds

Ramp-Down Rate:

6°C/second maximum

Time 25°C to Peak Temperature:

8 minutes maximum

Solder reflow

Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause

damage to other components.

1. Recommended max past thickness > 0.25mm.

2. Devices can be cleaned using standard methods and aqueous solvent.

3. Rework use standard industry practices.

4. Storage Environment : < 30°C/60% RH.

Caution:

1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

2. Devices are not designed to be wave soldered to the bottom side of the board.

Note 1: All temperatures refer to of the package, measured on the package body surface.

Pad Dimensions

Dimensions : Millimetres