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MAX17543 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX17543 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 19 page VIN to PGND .........................................................-0.3V to +48V EN/UVLO to SGND ...............................................-0.3V to +48V LX to PGND................................................-0.3V to (VIN + 0.3V) BST to PGND........................................................-0.3V to +53V BST to LX.............................................................-0.3V to +6.5V BST to VCC ...........................................................-0.3V to +48V CF, RESET, SS, MODE, SYNC, RT to SGND .....................................................-0.3V to +6.5V FB to SGND .........................................................-0.3V to +1.5V VCC to SGND.......................................................-0.3V to +6.5V SGND to PGND....................................................-0.3V to +0.3V LX Total RMS Current ...........................................................±4A Output Short-Circuit Duration....................................Continuous Continuous Power Dissipation (TA = +70ºC) (multilayer board) TQFN (derate 30.3mW/ºC above TA = +70ºC) ......2424.2mW Operating Temperature Range......................... -40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65ºC to +160°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow)....................................... +260ºC TQFN Junction-to-Ambient Thermal Resistance (θJA) ..........33ºC/W Junction-to-Case Thermal Resistance (θJC).................2ºC/W (Note 1) (VIN = VEN/UVLO = 24V, RRT = 40.2kΩ (500kHz), CVCC = 2.2μF, VPGND = VSGND = VMODE = VSYNC = 0V, LX = SS = RESET = open, VBST to VLX = 5V, VFB = 1V, TA = TJ = -40ºC to +125ºC, unless otherwise noted. Typical values are at TA = +25ºC. All voltages are referenced to SGND, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (VIN) Input Voltage Range VIN 4.5 42 V Input Shutdown Current IIN-SH VEN/UVLO = 0V (shutdown mode) 2.8 4.5 µA Input Quiescent Current IQ_PFM VFB = 1V, MODE = RT = open 118 VFB = 1V, MODE = open 162 IQ-DCM DCM mode, VLX = 0.1V 1.16 1.8 mA IQ_PWM Normal switching mode, fSW = 500kHz, VFB = 0.8V 9.5 ENABLE/UVLO (EN/UVLO) EN/UVLO Threshold VENR VEN/UVLO rising 1.19 1.215 1.26 V VENF VEN/UVLO falling 1.068 1.09 1.131 EN/UVLO Input Leakage Current IEN VEN/UVLO = 0V, TA = +25ºC -50 0 +50 nA LDO VCC Output Voltage Range VCC 6V < VIN < 42V, IVCC = 1mA 4.75 5 5.25 V 1mA ≤ IVCC ≤ 25mA VCC Current Limit IVCC-MAX VCC = 4.3V, VIN = 6V 26.5 54 100 mA VCC Dropout VCC-DO VIN = 4.5V, IVCC = 20mA 4.2 V VCC UVLO VCC_UVR VCC rising 4.05 4.2 4.3 V VCC_UVF VCC falling 3.65 3.8 3.9 MAX17543 4.5V–42V, 2.5A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensation www.maximintegrated.com Maxim Integrated │ 2 Electrical Characteristics Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Package Thermal Characteristics Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings |
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