EN/UVLO to SGND ...............................................-0.3V to +48V

BST to PGND........................................................-0.3V to +53V

BST to LX.............................................................-0.3V to +6.5V

CF, RESET, SS, MODE, SYNC,

RT to SGND .....................................................-0.3V to +6.5V

FB to SGND .........................................................-0.3V to +1.5V

SGND to PGND....................................................-0.3V to +0.3V

LX Total RMS Current ...........................................................±4A

Output Short-Circuit Duration....................................Continuous

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range.............................-65ºC to +160°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow)....................................... +260ºC

TQFN

(Note 1)

referenced to SGND, unless otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX UNITS

Input Voltage Range

4.5

42

V

Input Shutdown Current

2.8

4.5

µA

Input Quiescent Current

118

162

1.16

1.8

mA

9.5

ENABLE/UVLO (EN/UVLO)

EN/UVLO Threshold

1.19

1.215

1.26

V

1.068

1.09

1.131

EN/UVLO Input Leakage Current

-50

0

+50

nA

LDO

4.75

5

5.25

V

26.5

54

100

mA

4.2

V

4.05

4.2

4.3

V

3.65

3.8

3.9

MAX17543

4.5V–42V, 2.5A, High-Efficiency,

Synchronous Step-Down DC-DC Converter

with Internal Compensation

www.maximintegrated.com

Maxim Integrated │ 2

Electrical Characteristics

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Package Thermal Characteristics

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Absolute Maximum Ratings