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101

WH/WN Series

Miniature Molded Wirewound

Fea ture S

•WHprecisionseries

•WNArytonPerrywindingNon-Inductiveseries:

Inductance<1nHat1MHZtest,

•DesignedtomeetMIL-R-26F,MIL-STD-202stan-

dardrequirements

•Manufacturingprocess-Wirewinding/Spot

Welding-byComputerNumericalControl(CNC)

machinetoolstoensureconsistencyofproduct

quality.

•Encapsulatedbyepoxymoldingcompound

•AdvancedICencapsulationmold/dietechnologies

c H aracteri S tic S

Ceramic Core

End Caps

Stainless steel, precision formed

Leads

Copper wire,100% Sn (lead free)

coated

Resistance Wire

Encapsulation

SUMICON 1100/1200 Epoxy molding

compound for IC encapsulation

Standard Tolerance

D (0.5%), F (1.0%), J (5.0%)

Temperature

Coefficient (ppm/°C)

±90 for 0.100Ω-0.99Ω, ±50 for

1.00Ω-10.00Ω, ±20 for >10.00Ω

Maximum Working

Voltage

Derating Linearly from 100% @ +70°C to 0%

@ +150°C.

Operating Temp -55°C to +150°C

S erie S SP eci F icati ONS

Power

Resistance

Rating

Range

Weight

Type (watts)

(

Ω)

(g/1000pc)

WHA 0.5 0.100 - 1.0K

216

WNA

0.100 - 250

WHB

1

0.100 - 4.0K

296

WNB

0.100 - 1.0K

WHC

2

0.10 - 8.0K

712

WNC

0.10 - 2.0K

WHD

3

0.10 - 25K

1160

WND

0.10 - 5.0K

WHE

5

0.10 - 50K

2920

WNE

0.10 - 10K

LD

0.984 /

25

d

��

dime NS i ONS

Type

Wattage

L

D

d

WH/NA

0.5 5.08 / 0.200

2.54 / 0.100

0.60 / 0.024

WH/NB

1

7.00 / 0.276

3.30 / 0.130

0.60 / 0.024

WH/NC

2

11.4 / 0.450

4.57 / 0.180

0.80 / 0.031

WH/ND

3 13.54 / 0.530 5.50 / 0.216

0.80 / 0.031

WH/NE

5 20.00 / 0.790 7.50 / 0.295

1.00 / 0.039

Tape

Reel

Pc/

Width

Pitch

Diam.

reel

64 / 2.520 5.0 / 0.197 290 / 11.41 1000

64 / 2.520 5.0 / 0.197 290 / 11.41 1000

64 / 2.520 10 / 0.393 290 / 11.41 1000

84 / 3.307 10 / 0.393 290 / 11.41 500

84 / 3.307 10 / 0.393 290 / 11.41 500

Packaging

(continued)