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ADC12010 Datasheet(PDF) 5 Page - Texas Instruments

Part # ADC12010
Description  ADC12010 12-Bit, 10 MSPS, 160 mW A/D Converter with Internal Sample-and-Hold
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ADC12010 Datasheet(HTML) 5 Page - Texas Instruments

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ADC12010
www.ti.com
SNAS185B – APRIL 2003 – REVISED MARCH 2013
ABSOLUTE MAXIMUM RATINGS
(1) (2)
VA, VD
6.5V
VDR
≤VD +0.3V
|VA–VD|
≤ 100 mV
Voltage on Any Input or Output Pin
−0.3V to (VA or VD +0.3V)
Input Current at Any Pin (3)
±25 mA
Package Input Current (3)
±50 mA
Package Dissipation at TA = 25°C
See (4)
ESD Susceptibility
Human Body Model (5)
2500V
Machine Model (5)
250V
Soldering Temperature,
Infrared, 10 sec. (6)
235°C
Storage Temperature
−65°C to +150°C
(1)
All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3)
When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 25 mA to two.
(4)
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula
PDMAX = (TJmax - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
(5)
Human body model is 100 pF capacitor discharged through a 1.5 k
Ω resistor. Machine model is 220 pF discharged through 0Ω.
(6)
The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the
temperature at the top of the package body above 183°C for a minimum 60 seconds. The temperature measured on the package body
must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle.
OPERATING RATINGS
(1) (2)
Operating Temperature
−40°C ≤ TA ≤ +85°C
Supply Voltage (VA, VD)
+4.75V to +5.25V
Output Driver Supply (VDR)
+2.35V to VD
VREF Input
1.0V to 2.4V
CLK, PD, OE
−0.05V to (VD + 0.05V)
VIN Input
−0V to (VA − 0.5V)
VCM
1.0V to 4.0V
|AGND–DGND|
≤100mV
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2)
All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
PACKAGE THERMAL RESISTANCE
Package
θJA
32-Lead LQFP
79°C / W
Copyright © 2003–2013, Texas Instruments Incorporated
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