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ADC12010 Datasheet(PDF) 5 Page - Texas Instruments |
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ADC12010 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 30 page ADC12010 www.ti.com SNAS185B – APRIL 2003 – REVISED MARCH 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) VA, VD 6.5V VDR ≤VD +0.3V |VA–VD| ≤ 100 mV Voltage on Any Input or Output Pin −0.3V to (VA or VD +0.3V) Input Current at Any Pin (3) ±25 mA Package Input Current (3) ±50 mA Package Dissipation at TA = 25°C See (4) ESD Susceptibility Human Body Model (5) 2500V Machine Model (5) 250V Soldering Temperature, Infrared, 10 sec. (6) 235°C Storage Temperature −65°C to +150°C (1) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (3) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. (4) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula PDMAX = (TJmax - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. (5) Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 220 pF discharged through 0Ω. (6) The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the temperature at the top of the package body above 183°C for a minimum 60 seconds. The temperature measured on the package body must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle. OPERATING RATINGS (1) (2) Operating Temperature −40°C ≤ TA ≤ +85°C Supply Voltage (VA, VD) +4.75V to +5.25V Output Driver Supply (VDR) +2.35V to VD VREF Input 1.0V to 2.4V CLK, PD, OE −0.05V to (VD + 0.05V) VIN Input −0V to (VA − 0.5V) VCM 1.0V to 4.0V |AGND–DGND| ≤100mV (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. PACKAGE THERMAL RESISTANCE Package θJA 32-Lead LQFP 79°C / W Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ADC12010 |
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