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LMH6619 Datasheet(PDF) 2 Page - Texas Instruments |
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LMH6619 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 38 page LMH6618 ADC121S101 0.1 PF C6 10 PF C5 0.1 PF C13 10 PF C11 0.1 PF V + 0.01 PF 14.3 k: 0.1 PF 1 PF GND 5V 1.24 k: 1 nF 150 pF 549: V + - + 22: 390 pF 549: IN 1 PF V + 14.3 k: 5.6 PF LMH6618, LMH6619 SNOSAV7E – AUGUST 2007 – REVISED OCTOBER 2012 www.ti.com Typical Application These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) ESD Tolerance (2) Human Body Model For input pins only 2000V For all other pins 2000V Machine Model 200V Supply Voltage (VS = V + – V−) 12V Junction Temperature (3) 150°C max (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. OPERATING RATINGS (1) Supply Voltage (VS = V + – V−) 2.7V to 11V Ambient Temperature Range (2) −40°C to +125°C Package Thermal Resistance ( θJA) 6-Pin SOT (DDC0006A) 231°C/W 8-Pin SOIC (D0008A) 160°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2007–2012, Texas Instruments Incorporated Product Folder Links: LMH6618 LMH6619 |
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