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FE6D Datasheet(PDF) 1 Page - General Semiconductor |
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FE6D Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page FE6A THRU FE6D GLASS PASSIVATED FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 200 Volts Forward Current - 6.0 Amperes FEATURES ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Superfast recovery time-for high efficiency ♦ Low forward voltage, high current capability ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ Hermetically sealed package ♦ Low leakage current ♦ High surge current capability ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs, (2.3kg) tension MECHANICAL DATA Case: Solid glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.037 ounce, 1.04 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. . SYMBOLS FE6A FE6B FE6C FE6D UNITS Maximum repetitive peak reverse voltage VRRM 50 100 150 200 Volts Maximum RMS voltage VRMS 35 70 105 140 Volts Maximum DC blocking voltage VDC 50 100 150 200 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=55°C I(AV) 6.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed IFSM 135.0 Amps on rated load (JEDEC Method) Maximum instantaneous forward voltage at 6.0A VF 0.975 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=100°C IR 50.0 µA Maximum reverse recovery time (NOTE 1) trr 35.0 ns Typical junction capacitance (NOTE 2) CJ 100.0 pF Typical thermal resistance (NOTE 3, 4) R ΘJA 55.0 R ΘJL 18.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heatsinks (4) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. 4/98 0.180 (4.6) 0.115 (2.9) 0.042 (1.07) 0.038 (0.962) DIA. DIA. MAX. 0.300 (7.6) 1.0 (25.4) MIN. 1.0 (25.4) MIN. Case Style G4 Dimensions in inches and (millimeters) *Brazed lead assembly is covered by Patent No. 3,930,306 |
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