VOIDLESS-HERMETICALLY SEALED

ULTRA FAST RECOVERY GLASS

RECTIFIERS

S C O T TS DALE DIVISION

1N6620 thru 1N6625

DESCRIPTION

APPEARANCE

This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-

19500/585 and is ideal for high-reliability applications where a failure cannot be

tolerated.

These industry-recognized 1.5 to 2.0 Amp rated rectifiers for working

peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-

glass construction using an internal “Category I” metallurgical bond. These devices

are also available in surface mount MELF package configurations by adding a “US”

suffix (see separate data sheet for 1N6620US thru 1N6625US). Microsemi also

offers numerous other rectifier products to meet higher and lower current ratings

with various recovery time speed requirements including standard, fast and ultrafast

device types in both through-hole and surface mount packages.

Package “A”

Axial

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

Microsemi

Scottsdale Division

Page 1

FEATURES

APPLICATIONS / BENEFITS

•

Popular JEDEC registered 1N6620 to 1N6625 series

•

Voidless hermetically sealed glass package

•

Extremely robust construction

•

Triple-layer passivation

•

Internal “Category I” Metallurgical bonds

•

JAN, JANTX, and JANTXV available per MIL-PRF-

19500/585

•

Further options for screening in accordance with

MIL-PRF-19500 for JANS by using a “SP” prefix, e.g.

SP6620, SP6624, etc.

•

Surface mount equivalents also available in a square

end-cap MELF configuration with “US” suffix (see

separate data sheet for 1N6620US thru 1N6625US)

•

Ultrafast recovery rectifier series 200 to 1000 V

•

Military and other high-reliability applications

•

Switching power supplies or other applications

requiring extremely fast switching & low forward

loss

•

High forward surge current capability

•

Low thermal resistance

•

Controlled avalanche with peak reverse power

capability

•

MicroNote 050

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

•

Junction Temperature: -65

•

Storage Temperature: -65

•

Peak Forward Surge Current @ 25

(except 1N6625 which is 15 Amps)

Note: Test pulse = 8.3 ms, half-sine wave.

•

(L=.375 inch from body):

1N6620 thru 1N6622: 2.0 Amps

1N6623 thru 1N6625: 1.5 Amps

(Derate linearly at 0.833%/

•

1N6620 thru 1N6622: 1.2 Amps

1N6623 thru 1N6625: 1.0 Amp

(Derate linearly at 0.67%/

O

rating is typical for PC boards where thermal

resistance from mounting point to ambient is

•

•

•

Solder temperature: 260

•

CASE: Hermetically sealed voidless hard glass

with Tungsten slugs

•

TERMINATIONS: Axial-leads are Copper with

Tin/Lead (Sn/Pb) finish

•

MARKING: Body painted and part number, etc.

•

POLARITY: Cathode indicated by band

•

Tape & Reel option: Standard per EIA-296

•

Weight: 340 mg

•

See package dimensions on last page

Copyright

© 2009

10-06-2009 REV C; SA7-55.pdf

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503