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EGP20F Datasheet(PDF) 1 Page - General Semiconductor |
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EGP20F Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page EGP20A THRU EGP20G GLASS PASSIVATED FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 400 Volts Forward Current - 2.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratories Flammability Classification 94V-0 ♦ Glass passivated cavity-free junction ♦ Superfast recovery time for high efficiency ♦ Low forward voltage, high current capability ♦ Low leakage current ♦ High surge current capability ♦ High temperature metallurgically bonded construction ♦ High temperature soldering guaranteed: 300°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-204AC molded plastic over solid glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.015 ounce, 0.4 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. EGP EGP EGP EGP EGP EGP SYMBOLS 20A 20B 20C 20D 20F 20G UNITS Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 Volts Maximum RMS voltage VRMS 35 70 105 140 210 280 Volts Maximum DC blocking voltage VDC 50 100 150 200 300 400 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55°C I(AV) 2.0 Amps Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 75.0 Amps Maximum instantaneous forward voltage at 2.0A VF 0.95 1.25 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=125°C IR 100.0 µA Maximum reverse recovery time (NOTE 1) trr 50.0 ns Typical junction capacitance (NOTE 2) CJ 70.0 45.0 pF Typical thermal resistance (NOTE 3) R ΘJA 40.0 R ΘJL 15.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +150 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient, and from junction to lead at 0.375” (9.5mm) lead length, P.C.B. mounted 4/98 0.034 (0.86) 0.028 (0.71) 0.140 (3.6) 0.104 (2.6) DIA. DIA. 1.0 MIN. (25.4) 0.230 (5.8) 0.300 (7.6) 1.0 MIN. (25.4) DO-204AC Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306 ® |
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