EGF1A THRU EGF1D

ULTRAFAST SURFACE MOUNT RECTIFIER

Reverse Voltage - 50 to 200 Volts Forward Current - 1.0 Ampere

FEATURES

♦ Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

♦ Ideal for surface mount automotive applications

♦ High temperature metallurgically bonded construction

♦ Superfast recovery times for high efficiency

♦ Glass passivated cavity-free junction

♦ Built-in strain relief

♦ Easy pick and place

♦ High temperature soldering guaranteed: 450°C/5 seconds

at terminals

♦ Complete device submersible temperature of

265°C for 10 seconds in solder bath

MECHANICAL DATA

Case: JEDEC DO-214BA molded plastic over glass body

Terminals: Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity: Color band denotes cathode end

Weight: 0.0048 ounces, 0.120 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

SYMBOLS

EGF1A

EGF1B

EGF1C

EGF1D

UNITS

Device Marking Code

EA

EB

EC

ED

Maximum repetitive peak reverse voltage

50

100

150

200

Volts

Maximum RMS voltage

35

70

105

140

Volts

Maximum DC blocking voltage

50

100

150

200

Volts

Maximum average forward rectified current

1.0

Amps

Peak forward surge current

8.3ms single half sine-wave superimposed on

30.0

Amps

rated load (JEDEC Method)

Maximum instantaneous forward voltage at 1.0A

1.0

Volts

Maximum DC reverse current

5.0

at rated DC blocking voltage

50.0

µA

50.0

ns

15.0

pF

R

ΘJA

85.0

R

ΘJL

30.0

°C/W

Operating junction and storage temperature range

-65 to +175

°C

NOTES:

(3) Thermal resistance from junction to ambient and from junction to lead

P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas

4/98

0.167 (4.24)

0.187 (4.75)

0.0065 (0.17)

0.0105 (0.27)

0.030 (0.76)

0.060 (1.52)

0.006

0.152

TYP.

0.196 (4.98)

0.226 (5.74)

0.094 (2.39)

0.114 (2.90)

0.106 (2.69)

0.118 (3.00)

0.040 (1.02)

0.060 (1.52)

0.098 (2.49)

0.108 (2.74)

DO-214BA

®

Dimensions in inches and (millimeters)

Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead

forming by Patent No. 5,151,846