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EGF1C Datasheet(PDF) 1 Page - General Semiconductor |
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EGF1C Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page EGF1A THRU EGF1D ULTRAFAST SURFACE MOUNT RECTIFIER Reverse Voltage - 50 to 200 Volts Forward Current - 1.0 Ampere FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Ideal for surface mount automotive applications ♦ High temperature metallurgically bonded construction ♦ Superfast recovery times for high efficiency ♦ Glass passivated cavity-free junction ♦ Built-in strain relief ♦ Easy pick and place ♦ High temperature soldering guaranteed: 450°C/5 seconds at terminals ♦ Complete device submersible temperature of 265°C for 10 seconds in solder bath MECHANICAL DATA Case: JEDEC DO-214BA molded plastic over glass body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.0048 ounces, 0.120 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS EGF1A EGF1B EGF1C EGF1D UNITS Device Marking Code EA EB EC ED Maximum repetitive peak reverse voltage VRRM 50 100 150 200 Volts Maximum RMS voltage VRMS 35 70 105 140 Volts Maximum DC blocking voltage VDC 50 100 150 200 Volts Maximum average forward rectified current at TL=125°C I(AV) 1.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on IFSM 30.0 Amps rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.0A VF 1.0 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=125°C IR 50.0 µA Typical reverse recovery time (NOTE 1) trr 50.0 ns Typical junction capacitance (NOTE 2) CJ 15.0 pF Typical thermal resistance (NOTE 3) R ΘJA 85.0 R ΘJL 30.0 °C/W Operating junction and storage temperature range TJ,TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied VR=4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas 4/98 0.167 (4.24) 0.187 (4.75) 0.0065 (0.17) 0.0105 (0.27) 0.030 (0.76) 0.060 (1.52) 0.006 0.152 TYP. 0.196 (4.98) 0.226 (5.74) 0.094 (2.39) 0.114 (2.90) 0.106 (2.69) 0.118 (3.00) 0.040 (1.02) 0.060 (1.52) 0.098 (2.49) 0.108 (2.74) DO-214BA ® Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 |
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